EARTHTRON BLOG

Subscribe to this Blog.

  HELP WITH RFQ

 

  

JOHN PALLAZOLA

A 1987 graduate of Tufts University, John started in supply chain management in 1989. Over the years he gained an expertise in excess management, kitting and inventory control. He was the first to create the EPIC (Excess Placement and Inventory Control) supply chain management system. In 1995 he started a new division of a small start-up (MGI) which was acquired by Azego. That became the basis for one of the only publicly traded independent distributors in the world. He eventually attained the position of VP/Director of Pan-American Operations prior to branching off and starting Earthtron LLC.
Find me on:

Recent Posts

New Electronics Are Designed To Self-Destruct At Room Temperature

Posted by JOHN PALLAZOLA

Jul 19, 2017 8:46:00 AM

 Dissolvable Electronics 
Read More

Topics: Electronic Components

Stanford University and MIT Built a New 3-D Chip for Computing and Data Storage

Posted by JOHN PALLAZOLA

Jul 12, 2017 9:08:00 AM

As embedded intelligence is finding its way into ever more areas of our lives, fields ranging from autonomous driving to personalized medicine are generating huge amounts of data. But just as the flood of data is reaching massive proportions, the ability of computer chips to process it into useful information is stalling.

The Team: Researchers at Stanford University and MIT have built a new chip to overcome this hurdle. The team is made up of; Max Shulaker, an assistant professor of electrical engineering and computer science at MIT, H.S. Philip Wong, Subhasish Mitra, professors of electrical engineering and computer science at Stanford. The team also included professors Roger Howe and Krishna Saraswat, also from Stanford.

 

 

Computers today are comprised of different chips cobbled together. There is a chip for computing and a separate chip for data storage, and the connections between the two are limited. As applications analyze increasingly massive volumes of data, the limited rate at which data can be moved between different chips is creating a critical communication bottleneck. And with limited room on the board, there is not enough room to place them side-by-side. Even worse, the underlying devices; transistors made from silicon, are no longer improving at the historic rate that they have for decades.

Part Search

The new prototype chip: is a radical change from today’s chips. It uses multiple nanotechnologies, together with a new computer architecture, to reverse both of these trends.

Instead of relying on silicon-based devices, the chip uses carbon nanotubes, which are sheets of 2-D graphene formed into nanocylinders, and resistive random-access memory (RRAM) cells, a type of nonvolatile memory that operates by changing the resistance of a solid dielectric material. The researchers integrated over 1 million RRAM cells and 2 million carbon nanotube field-effect transistors, making the most complex nanoelectronic system ever made with emerging nanotechnologies.

The RRAM and carbon nanotubes are built vertically over one another, making a new, dense 3-D computer architecture with interleaving layers of logic and memory. By inserting ultradense wires between these layers, this 3-D architecture promises to address the communication bottleneck.

3-D integration can address another key consideration in systems: the interconnects within and between chips. The new 3-D computer architecture provides dense and fine-grained integration of computating and data storage, drastically overcoming the bottleneck from moving data between chips. Because of that, the chip is able to store massive amounts of data and perform on-chip processing to transform a data deluge into useful information.

 

 

To demonstrate the potential of the technology: the researchers took advantage of the ability of carbon nanotubes to also act as sensors. On the top layer of the chip they placed over 1 million carbon nanotube-based sensors, which they used to detect and classify ambient gases.

Due to the layering of sensing, data storage, and computing, the chip was able to measure each of the sensors in parallel, and then write directly into its memory, generating huge bandwidth.

Three-dimensional integration: is the most promising approach to allow an increasing number of devices to be integrated per unit volume.

The team is working to improve the underlying nanotechnologies, while exploring the new 3-D computer architecture. The next step is working with Massachusetts-based semiconductors company Analog Devices to develop new versions of the system that take advantage of its ability to carry out sensing and data processing on the same chip.

For example, the devices could be used to detect signs of disease by sensing particular compounds in a patient’s breath. This has the potential to be the platform for many revolutionary applications in the future!

Read More

Topics: Electronic Components, Computers, technology

Drones That Fly and Drive

Posted by JOHN PALLAZOLA

Jul 10, 2017 8:35:00 AM

CSAIL team’s drones that fly and drive suggest another approach to developing flying cars.

Researchers from MIT’s Computer Science and Artificial Intelligence Laboratory (CSAIL) are aiming to develop robots that can both maneuver around on land and take to the skies. The team presented a system of eight quadcopter drones that can fly and drive through a city-like setting with parking spots, no-fly zones, and landing pads.
Read More

Topics: artificial intelligence, drones

FPGAs Supporting Data Transactions and Network Security

Posted by JOHN PALLAZOLA

Jul 7, 2017 8:33:00 AM

The risks to businesses from failing security policies and products make the investment in better security technologies more than being cost effectiveness, but an important necessity. The entire security product/software industry relies on a set of existing codes and threat models, without the vision or resources to develop new technologies, and without an evolved understanding of future threats. 
Read More

Topics: FPGA

Apple's iPhone 8 is Built with These Electronic Components

Posted by JOHN PALLAZOLA

Jul 6, 2017 9:41:34 AM

Read More

Topics: Electronic Components

Apple Shows Interest in Machine Learning for Their Autonomous Car

Posted by JOHN PALLAZOLA

Jun 27, 2017 8:27:00 AM

 
Read More

Topics: technology, ADAS, Autonomous Driving, machine learning

EarthTron is Looking for Excess on Xilinx Virtex-7 2000T

Posted by JOHN PALLAZOLA

Jan 24, 2017 2:34:57 PM

 
We are looking for excess inventory on Xilinx Virtex-7 2000T, part numbers XC7V2000T-2FLG1925C and XC7V2000T-2FHG1761C.  

 
Virtex®-7 FPGAs are optimized for system performance and integration at 28nm and bring top DSP performance, and I/O bandwidth designs. The family is used in an array of applications such as 10G to 100G networking, portable radar, and ASIC Prototyping.
 
You can Contact us sales@earthtron.com or by clicking the button below.
Click For Fast Quote:  Xilinx FPGA
 

EarthTron LLC is an Unlimited Franchised Distributor of Electronic Components and Products. We provide customers with services not available from a restricted Franchised Distributor. In addition to our franchised lines we give you the convenience of only having to go to one company for ALL of your electronic component needs. This saves you the time of having to contact multiple companies for every part that you need. Our experience in the industry gives you the confidence that we only source from quality suppliers, to deliver quality parts. Save 15% on Micron SLC FLash Memory, Micron SLC Memory / Micron slc nand memory.

 
 
  Contact EarthTron LLC to Sell Xilinx Virtex-7 FPGA
Call us: 1-800-322-2130
 
EarthTron, located in Portsmouth, NH, is an Inc.500|5000 company.
 
Read More

Topics: FPGA, xilinx

KINTEX-7 FBG (FB) vs. FFG (FF), ARE THEY COMPATIBLE AND WHICH IS BETTER?

Posted by JOHN PALLAZOLA

Nov 30, 2016 4:41:13 PM

 

Other than a bit of community chatter (much of it contradictory) there is very little easily digestible information on the differences between the Xilinx Flip Chip (FF- LEADED, FFG-LEADFREE) and the Xilinx Lidless Flip Chip (FB-LEADED, FBG-LEADFREE). Xilinx is very good about providing the information needed if you know where to look. We have worked with many OEMs that have used one or the other or both. In this case, you may want to refer to the following Xilinx data sheet and user guide for more details:

 

UG475

DS182

 

Here is a comparison from Avnet showing that the two devices are pin for pin compatible:

   

XC7K410T-1FBG900I

XC7K410T-1FFG900I

   

Datasheet

Datasheet

 

Kintex-7 FPGA Device-Package Combinations and Maximum I/Os. Devices in FBG900/FBV900 and FFG900/FFV900 are footprint compatible.


 

In a nutshell, the better performing FF/FFG should almost always work in place of the FB/FBG, but not vice versa. The lidless chip will often work in place of the FF/FFG, but with limited performance, including reduced max speeds and diminished thermal properties. The FF/FFG enables faster transfer speeds, better thermal properties, and less margin for error. The FB/FBG has a slightly lower initial height but once the thermal interface material (TIM) and heatsink is applied that dimension frequently becomes irrelevant.

---------------------------------------------------------------------------------------------------------------------------------

The FB/FBG lidless package requires MANY special considerations and here are a few:

1. Component Pick-up Tool Consideration

For automated pick-and-place machines placing lidless flip-chip BGAs onto PCBs, Xilinx recommends using suction cups or soft tips on the nozzles. Failure to do so will cause chipping, scratching, and cracking of the bare die which can render the chip unusable. This may also lead to failures both immediate or later in the field.

2. TIM (Thermal Interface Material)

Lidless Flip Chips require a layer of thermal interface material between the top of the chip and the heatsink. Because the process of applying this material and the plethora of different materials that can be used it creates another variable that exists even inside a homogenous batch of boards. The upgraded FFG (FF) already has the TIM and heat spreader onboard and built to the exacting Xilinx factory specs, eliminating variables and the concerns of damaging or improperly prepping the FPGA.

3. Heat Sink Guidelines for Lidless Flip-Chip (FB/FBG) Packages

Lidless Flip Chip Concerns:

1. Inconsistent or uneven Force applied.

2. TIM with bond line thickness that is not exactly equal.

3. Even slightly off parallel alignment of the heatsink to the top of silicon will damage and/or destroy the chip.

As you can see, improper heatsink placement onto the die will cause damage and render the lidless chip worthless. 


Here are some of the upgrade/benefits of the FFG/FF: 

1. TIM (Thermal Interface Material) is already resident.

2. Heat spreader lid which has a flat and uniform surface for the attachment of any additional desired heatsink.

3. Superior thermal/heat dissipation properties of the FFG vs the FBG, excerpted here:



Read More

Topics: FPGA, xilinx

Contact EarthTron for Avnet and Xilinx FPGA

Posted by JOHN PALLAZOLA

Jul 13, 2016 3:59:49 PM

 

 

     Do you have a project that's using Xilinx FPGA? Contact us for a quote

 REQUEST FOR QUOTE 

Most active part numbers are available through our subsidiary, FPGABuy. Click here to to determine if the Xilinx part(s) you are looking for is available.

Read More

Topics: FPGA, xilinx

4 Steps to take when Buying Obsolete Electronic Components

Posted by JOHN PALLAZOLA

May 15, 2015 12:35:57 PM

     There are bad people in this world. There are people who scheme and plot to expose a weakness or vulnerability of someone in a desperate situation in order to gain maximum benefit for themselves. Counterfeiters are such people. When it comes to buying obsolete electronic components all the ingredients exist for these surreptitious endeavors.

Read More

Topics: FPGA

Make your Excess  Components Disappear